this is information on a product in full production. august 2014 docid026718 rev 1 1/8 stth2r06-y automotive turbo 2 ultrafast high voltage rectifier datasheet - production data features ? ultrafast recovery ? low switching losses ? high surge capability ? low leakage current ? high junction temperature ? aec-q101 qualified ? ecopack ? 2 compliant component ? v rrm guaranteed from -40 to +175 c description the stth2r06-y is an ultrafast recovery power rectifier dedicated to energy recovery in automotive application housed in smbflat to improve space saving. it is especially designed for clamping function in energy recovery block. the compromise between forward voltage drop and recovery time offers optimized performances. k a smbflat k a table 1. device summary symbol value i f(av) 2 a v rrm 600 v t j (max) 175 c v f (typ) 1.1 v t rr (typ) 35 ns www.st.com
characteristics stth2r06-y 2/8 docid026718 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 1.10 x i f(av) + 0.15 x i f 2 (rms) table 2. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage t j = -40 to +175 c 600 v i f(av) average forward current, square waveform t l = 110 c = 0.5 2 a i fsm forward surge current t p = 10 ms 28 a t stg storage temperature range -65 to + 175 c t j (1) 1. condition to avoid thermal runaway for a diode on its own heatsink operating temperature range -40 to + 175 c table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead 18 c/w table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. pulse test: tp = 5 ms, < 2% reverse leakage current t j = 25 c v r = 600 v -2 a t j = 150 c - 12 85 v f (2) 2. pulse test: tp = 380 s, < 2% forward voltage drop t j = 25 c i f = 2a -1.9 v t j = 150 c - 1.1 1.4 table 5. dynamic electrical characteristics symbol parameter tests conditions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 1 a, di f /dt = -50 a/s v r = 30 v -3550 ns t fr forward recovery time t j = 25 c i f = 2 a, di f /dt = 100 a/s, v fr = 2.5 v -80 v fp forward recovery voltage -7v dptot dtj < 1 rth(j-a)
docid026718 rev 1 3/8 stth2r06-y characteristics 8 figure 1. average forward power dissipation versus average forward current figure 2. forward voltage drop versus forward current (typical values) p f(av) (w) 0 1 2 3 4 0.0 0.5 1.0 1.5 2.0 2.5 = 0.05 = 0.1 = 0.2 = 1 = 0.5 t =tp/t tp i f(av) (a) i f (a) 0.01 0.10 1.00 10.00 0.0 0.5 1.0 1.5 2.0 2.5 t = 150c j v(v) f t = 25c j figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance junction to lead versus pulse duration i f (a) 0.01 0.10 1.00 10.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v(v) f t = 25c j t = 150c j z th(j- ) /r th(j- ) ll 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse t p (s) figure 5. peak reverse recovery current versus di f /dt (typical values) figure 6. reverse recovery time versus di f /dt (typical values) i(a) rm 0 1 2 3 4 5 6 7 8 9 0 50 100 150 200 250 300 350 400 450 500 di /dt a/ f (s) v = 400 v r t = 125 c j i = 2 x i (av) ff i = i (av) ff i = 0.5 x i (av) ff tns rr () 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 450 500 v = 400 v r t = 125 c j di /dt a/ f (s) i = 0.5 x i (av) ff i = i (av) ff i = 2 x i (av) ff
characteristics stth2r06-y 4/8 docid026718 rev 1 figure 7. reverse recovery charges versus di f /dt (typical values) figure 8. relative variation of dynamic parameters versus junction temperature qnc rr () 0 50 100 150 200 250 300 350 400 0 100 200 300 400 500 v = 400 v r t = 125 c j i = 2 x i (av) ff i = i (av) ff i = 0.5 x i (av) ff di /dt a/ f (s) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 q rr t rr i rm i = i (av) ff v = 400 v r reference: t = 125 c j tc j () figure 9. transient peak forward voltage versus di f /dt (typical values) figure 10. forward recovery time versus di f /dt (typical values) 0 2 4 6 8 10 12 20 40 60 80 100 120 140 160 180 200 di /dt a/ f (s) i= i f f(av) t = 125 c j vv fp () t ns) fr ( 0 20 40 60 80 100 120 20 40 60 80 100 120 140 160 180 200 i= i f f(av) v = 2.5 v fr t = 125 c j di /dt a/ f (s) figure 11. junction capacitance versus reverse voltage applied (typical values) figure 12. thermal resistance junction to ambient versus copper surface under each lead (typical values) c pf) ( 1 10 100 1 10 100 1000 v r (v) f = 1 mhz v = 30 mv osc rms t = 25 c j r th(j-a) (c/w) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smbflat s (cm2) cu epoxy printed circuit board fr4, copper thickness: 35 m
docid026718 rev 1 5/8 stth2r06-y package information 8 2 package information ? epoxy meets ul94,v0 ? lead-free package ? band indicates cathode in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. smbflat di mensions definitions d a l2x l l1 2x l2 2x e e1 b c
package information stth2r06-y 6/8 docid026718 rev 1 figure 14. smbflat footprint, dimensions in mm (inches) table 6. smbflat dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.155 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 1.20 (0.047) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082)
docid026718 rev 1 7/8 stth2r06-y ordering information 8 3 ordering information 4 revision history table 7. ordering information order codes marking package weight base qty delivery mode STTH2R06UFY f2r6y smbflat 50 mg 5000 tape and reel table 8. document revision history date revision changes 04-aug-2014 1 initial release.
stth2r06-y 8/8 docid026718 rev 1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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